video1.0<iframe src="https://www.loom.com/embed/3c633a40ea84442e9853f7c232277dca" frameborder="0" width="1920" height="1440" webkitallowfullscreen mozallowfullscreen allowfullscreen></iframe>14401920Loomhttps://www.loom.com14401920https://cdn.loom.com/sessions/thumbnails/3c633a40ea84442e9853f7c232277dca-c2bc38a8495e5d20.gif325.141This Loom explains a three-layer dynamic ICP scoring workflow in Clay for an AI connectivity platform. The first layer creates a seed list from Cortex using a deterministic ICP definition to generate 50 structurally fitting companies in batches, avoiding expensive top-50 filtering from larger TAM sourcing lists. The second layer uses Clare to score technographic readiness based on cloud, engineering, and legacy IT signals using a mix of LLM-based scraping, enrichment, synthesis, and composite scoring, with optional pain point detection. The third layer detects active buying and building signals; all three layers are combined with formulaic logic into a composite score out of 100 for downstream ABM rubric assignment.